Micro-nano foundry packaging

In micro-nano foundry, packaging was a difficult process a few years ago. In the early MEMS products, packaging technology mostly borrowed the ready-made packaging technology in semiconductor IC. However, with the development of production and changes in the application environment and scope, there is no unified packaging form, and a suitable packaging form is basically used.

According to statistics, the cost of packaging accounts for about 70%-80% of the total cost of MEMS products. Since packaging can only be done individually and cannot be done in large quantities at the same time, many micro-nano foundry companies are unwilling to package and test MEMS products. That is to say, there are not many micro-nano foundry companies that can outsource packaging. It is also a headache.

In recent years, MEMS packaging technology has made great progress, and a variety of MEMS packaging technologies have emerged, which can be applied to different packaging requirements in special fields. Researchers have developed a versatile and complete package design, which has three levels of packaging atmosphere: system-level packaging, chip-level packaging and wafer-level packaging. The packaging of MEMS products is not compatible with traditional IC packaging. For example, dicing is not compatible. From zero-level packaging to wafer-level packaging, most companies must complete them themselves. The back-end test is not a simple electrical test, for example, the accelerometer needs to be physically tested.

There are also foreign companies that put forward the concept of modularity, allowing MEMS devices to be mass-produced in a unified, standardized package, shortening the time, and making an important breakthrough in packaging in micro-nano foundry. YW MEMS provide TO packaging, lead packaging and vacuum packaging.